APA (7th ed.) Citation

Zhou, T., Lu, F., Shang, M., Wang, Y., & Ma, H. (2025). Study of Electrochemical Migration Behavior of Sn1.0Ag Solder. Metals (2075-4701), 15(4), 434. https://doi.org/10.3390/met15040434

Chicago Style (17th ed.) Citation

Zhou, Tianshuo, Fuye Lu, Min Shang, Yunpeng Wang, and Haitao Ma. "Study of Electrochemical Migration Behavior of Sn1.0Ag Solder." Metals (2075-4701) 15, no. 4 (2025): 434. https://doi.org/10.3390/met15040434.

MLA (9th ed.) Citation

Zhou, Tianshuo, et al. "Study of Electrochemical Migration Behavior of Sn1.0Ag Solder." Metals (2075-4701), vol. 15, no. 4, 2025, p. 434, https://doi.org/10.3390/met15040434.