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Study of Electrochemical Migration Behavior of Sn1.0Ag Solder.

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Title: Study of Electrochemical Migration Behavior of Sn1.0Ag Solder.
Authors: Zhou, Tianshuo1, Lu, Fuye1, Shang, Min1, Wang, Yunpeng1, Ma, Haitao1, htma@dlut.edu.cn
Source: Metals (2075-4701); Apr2025, Vol. 15 Issue 4, p434, 14p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 184793845
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PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Study of Electrochemical Migration Behavior of Sn1.0Ag Solder.
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RecordInfo BibRecord:
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      – Type: doi
        Value: 10.3390/met15040434
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      – Code: eng
        Text: English
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        PageCount: 14
        StartPage: 434
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      – TitleFull: Study of Electrochemical Migration Behavior of Sn1.0Ag Solder.
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            NameFull: Zhou, Tianshuo
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            NameFull: Lu, Fuye
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            NameFull: Shang, Min
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            NameFull: Wang, Yunpeng
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              Text: Apr2025
              Type: published
              Y: 2025
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              Value: 15
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              Value: 4
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