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Microstructural Investigation of Sn-Based Solder Reactions with FeCoNiCrMn High-Entropy Alloy at Various Temperatures.

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Bibliographic Details
Title: Microstructural Investigation of Sn-Based Solder Reactions with FeCoNiCrMn High-Entropy Alloy at Various Temperatures.
Authors: Wang, Chao-hong1, chmchw@ccu.edu.tw, Li, Yue-han1
Source: JOM: The Journal of The Minerals, Metals & Materials Society (TMS); Jun2025, Vol. 77 Issue 6, p4161-4172, 12p
Database: Applied Science & Technology Source
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ISSN:10474838
DOI:10.1007/s11837-025-07204-6