Effect of sub-zero temperature on the reliability of SAC305/Cu nanocomposite solder joints.
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| Title: | Effect of sub-zero temperature on the reliability of SAC305/Cu nanocomposite solder joints. |
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| Authors: | Plevachuk, Yu.1,2, yuriy.plevachuk@lnu.edu.ua, Poverzhuk, V.2, Švec Sr, P.1, Švec, P.1,3, Orovcik, L.4, Bajana, O.4 |
| Source: | Journal of Materials Science: Materials in Electronics; May2025, Vol. 36 Issue 15, p1-13, 13p |
| Database: | Applied Science & Technology Source |
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| FullText | Links: – Type: pdflink Text: Availability: 1 |
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| Header | DbId: aci DbLabel: Applied Science & Technology Source An: 185638719 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=185638719 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1007/s10854-025-14984-9 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 13 StartPage: 1 Titles: – TitleFull: Effect of sub-zero temperature on the reliability of SAC305/Cu nanocomposite solder joints. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Plevachuk, Yu. – PersonEntity: Name: NameFull: Poverzhuk, V. – PersonEntity: Name: NameFull: Švec Sr, P. – PersonEntity: Name: NameFull: Švec, P. – PersonEntity: Name: NameFull: Orovcik, L. – PersonEntity: Name: NameFull: Bajana, O. IsPartOfRelationships: – BibEntity: Dates: – D: 21 M: 05 Text: May2025 Type: published Y: 2025 Identifiers: – Type: issn-print Value: 09574522 Numbering: – Type: volume Value: 36 – Type: issue Value: 15 Titles: – TitleFull: Journal of Materials Science: Materials in Electronics Type: main |
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