Effect of sub-zero temperature on the reliability of SAC305/Cu nanocomposite solder joints.

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Title: Effect of sub-zero temperature on the reliability of SAC305/Cu nanocomposite solder joints.
Authors: Plevachuk, Yu.1,2, yuriy.plevachuk@lnu.edu.ua, Poverzhuk, V.2, Švec Sr, P.1, Švec, P.1,3, Orovcik, L.4, Bajana, O.4
Source: Journal of Materials Science: Materials in Electronics; May2025, Vol. 36 Issue 15, p1-13, 13p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 185638719
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PubType: Academic Journal
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; May2025, Vol. 36 Issue 15, p1-13, 13p
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        Value: 10.1007/s10854-025-14984-9
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        Text: English
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      – TitleFull: Effect of sub-zero temperature on the reliability of SAC305/Cu nanocomposite solder joints.
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              M: 05
              Text: May2025
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              Y: 2025
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