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High corrosion resistance and tensile strength in SAC305/Cu solder joint via super-rapid cooling.

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Title: High corrosion resistance and tensile strength in SAC305/Cu solder joint via super-rapid cooling.
Authors: Yang, Jiyou1, Ren, Hao1, Yang, Linmei1, lmyang10b@alum.imr.ac.cn, Huang, Te1, Buren, Bayaer1, Liang, Yawei1
Source: Journal of Materials Science: Materials in Electronics; Apr2025, Vol. 36 Issue 12, p1-14, 14p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 185713146
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
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  Data: High corrosion resistance and tensile strength in SAC305/Cu solder joint via super-rapid cooling.
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  Data: <searchLink fieldCode="AU" term="%22Yang%2C+Jiyou%22">Yang, Jiyou</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Ren%2C+Hao%22">Ren, Hao</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Yang%2C+Linmei%22">Yang, Linmei</searchLink><relatesTo>1</relatesTo>, <i>lmyang10b@alum.imr.ac.cn</i><br /><searchLink fieldCode="AU" term="%22Huang%2C+Te%22">Huang, Te</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Buren%2C+Bayaer%22">Buren, Bayaer</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Liang%2C+Yawei%22">Liang, Yawei</searchLink><relatesTo>1</relatesTo>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Apr2025, Vol. 36 Issue 12, p1-14, 14p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=185713146
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        Value: 10.1007/s10854-025-14787-y
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        Text: English
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      – TitleFull: High corrosion resistance and tensile strength in SAC305/Cu solder joint via super-rapid cooling.
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            NameFull: Ren, Hao
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            NameFull: Yang, Linmei
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            NameFull: Huang, Te
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            – D: 21
              M: 04
              Text: Apr2025
              Type: published
              Y: 2025
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