APA (7th ed.) Citation

Yang, S., Tang, Q., Xiao, Z., Li, G., & Jiang, Z. (2025). Enhanced dynamic network restructuring of recyclable dual-cured epoxy resins. Journal of Materials Science: Materials in Electronics, 36(11), 1. https://doi.org/10.1007/s10854-025-14755-6

Chicago Style (17th ed.) Citation

Yang, Senyuan, Qijun Tang, Zhichao Xiao, Guanyi Li, and Zhuozhen Jiang. "Enhanced Dynamic Network Restructuring of Recyclable Dual-cured Epoxy Resins." Journal of Materials Science: Materials in Electronics 36, no. 11 (2025): 1. https://doi.org/10.1007/s10854-025-14755-6.

MLA (9th ed.) Citation

Yang, Senyuan, et al. "Enhanced Dynamic Network Restructuring of Recyclable Dual-cured Epoxy Resins." Journal of Materials Science: Materials in Electronics, vol. 36, no. 11, 2025, p. 1, https://doi.org/10.1007/s10854-025-14755-6.