APA (7th ed.) Citation

Li, H., Jiang, H., Shen, J., Luo, D., & Chen, Q. (2025). Effect of nickel on the Cu–Sn based joint material. Journal of Materials Science: Materials in Electronics, 36(18), 1. https://doi.org/10.1007/s10854-025-15177-0

Chicago Style (17th ed.) Citation

Li, Hanbing, Hui Jiang, Jun Shen, D. Luo, and Q. Chen. "Effect of Nickel on the Cu–Sn Based Joint Material." Journal of Materials Science: Materials in Electronics 36, no. 18 (2025): 1. https://doi.org/10.1007/s10854-025-15177-0.

MLA (9th ed.) Citation

Li, Hanbing, et al. "Effect of Nickel on the Cu–Sn Based Joint Material." Journal of Materials Science: Materials in Electronics, vol. 36, no. 18, 2025, p. 1, https://doi.org/10.1007/s10854-025-15177-0.