View in EDS HTML Full Text PDF Full Text

Effect of nickel on the Cu–Sn based joint material.

Saved in:
Bibliographic Details
Title: Effect of nickel on the Cu–Sn based joint material.
Authors: Li, Hanbing1, Jiang, Hui1, Shen, Jun1, shenjun@cqu.edu.cn, Luo, D.2, Chen, Q.2
Source: Journal of Materials Science: Materials in Electronics; Jun2025, Vol. 36 Issue 18, p1-12, 12p
Database: Applied Science & Technology Source
Full text is not displayed to guests.
FullText Links:
  – Type: pdflink
Text:
  Availability: 1
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 186104852
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
IllustrationInfo
Items – Name: Title
  Label: Title
  Group: Ti
  Data: Effect of nickel on the Cu–Sn based joint material.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AU" term="%22Li%2C+Hanbing%22">Li, Hanbing</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Jiang%2C+Hui%22">Jiang, Hui</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Shen%2C+Jun%22">Shen, Jun</searchLink><relatesTo>1</relatesTo>, <i>shenjun@cqu.edu.cn</i><br /><searchLink fieldCode="AU" term="%22Luo%2C+D%2E%22">Luo, D.</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Chen%2C+Q%2E%22">Chen, Q.</searchLink><relatesTo>2</relatesTo>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Jun2025, Vol. 36 Issue 18, p1-12, 12p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=186104852
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1007/s10854-025-15177-0
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 12
        StartPage: 1
    Titles:
      – TitleFull: Effect of nickel on the Cu–Sn based joint material.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Li, Hanbing
      – PersonEntity:
          Name:
            NameFull: Jiang, Hui
      – PersonEntity:
          Name:
            NameFull: Shen, Jun
      – PersonEntity:
          Name:
            NameFull: Luo, D.
      – PersonEntity:
          Name:
            NameFull: Chen, Q.
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 21
              M: 06
              Text: Jun2025
              Type: published
              Y: 2025
          Identifiers:
            – Type: issn-print
              Value: 09574522
          Numbering:
            – Type: volume
              Value: 36
            – Type: issue
              Value: 18
          Titles:
            – TitleFull: Journal of Materials Science: Materials in Electronics
              Type: main
ResultId 1