APA (7th ed.) Citation

Zeng, X., Pan, Z., Hu, G., Xia, G., Huang, H., Zou, M., & Shi, S. (2025). Exploration of poly(1,4-butanediol diglycidyl ether, 2-methylimidazole, and imidazole) as leveling agents in blind hole copper plating. Journal of Materials Science: Materials in Electronics, 36(18), 1. https://doi.org/10.1007/s10854-025-15125-y

Chicago Style (17th ed.) Citation

Zeng, Xiangjian, Zhanchang Pan, Guanghui Hu, Guowei Xia, Haiqing Huang, Mingliang Zou, and Shikun Shi. "Exploration of Poly(1,4-butanediol Diglycidyl Ether, 2-methylimidazole, and Imidazole) as Leveling Agents in Blind Hole Copper Plating." Journal of Materials Science: Materials in Electronics 36, no. 18 (2025): 1. https://doi.org/10.1007/s10854-025-15125-y.

MLA (9th ed.) Citation

Zeng, Xiangjian, et al. "Exploration of Poly(1,4-butanediol Diglycidyl Ether, 2-methylimidazole, and Imidazole) as Leveling Agents in Blind Hole Copper Plating." Journal of Materials Science: Materials in Electronics, vol. 36, no. 18, 2025, p. 1, https://doi.org/10.1007/s10854-025-15125-y.