Exploration of poly(1,4-butanediol diglycidyl ether, 2-methylimidazole, and imidazole) as leveling agents in blind hole copper plating.
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| Title: | Exploration of poly(1,4-butanediol diglycidyl ether, 2-methylimidazole, and imidazole) as leveling agents in blind hole copper plating. |
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| Authors: | Zeng, Xiangjian1, Pan, Zhanchang1, panzhanchang@163.com, Hu, Guanghui1, Xia, Guowei2, Huang, Haiqing2, Zou, Mingliang2, Shi, Shikun2 |
| Source: | Journal of Materials Science: Materials in Electronics; Jun2025, Vol. 36 Issue 18, p1-17, 17p |
| Database: | Applied Science & Technology Source |
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| FullText | Links: – Type: pdflink Text: Availability: 1 |
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| Header | DbId: aci DbLabel: Applied Science & Technology Source An: 186232697 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Exploration of poly(1,4-butanediol diglycidyl ether, 2-methylimidazole, and imidazole) as leveling agents in blind hole copper plating. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AU" term="%22Zeng%2C+Xiangjian%22">Zeng, Xiangjian</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Pan%2C+Zhanchang%22">Pan, Zhanchang</searchLink><relatesTo>1</relatesTo>, <i>panzhanchang@163.com</i><br /><searchLink fieldCode="AU" term="%22Hu%2C+Guanghui%22">Hu, Guanghui</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Xia%2C+Guowei%22">Xia, Guowei</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Huang%2C+Haiqing%22">Huang, Haiqing</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Zou%2C+Mingliang%22">Zou, Mingliang</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Shi%2C+Shikun%22">Shi, Shikun</searchLink><relatesTo>2</relatesTo> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Jun2025, Vol. 36 Issue 18, p1-17, 17p |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=186232697 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1007/s10854-025-15125-y Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 17 StartPage: 1 Titles: – TitleFull: Exploration of poly(1,4-butanediol diglycidyl ether, 2-methylimidazole, and imidazole) as leveling agents in blind hole copper plating. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Zeng, Xiangjian – PersonEntity: Name: NameFull: Pan, Zhanchang – PersonEntity: Name: NameFull: Hu, Guanghui – PersonEntity: Name: NameFull: Xia, Guowei – PersonEntity: Name: NameFull: Huang, Haiqing – PersonEntity: Name: NameFull: Zou, Mingliang – PersonEntity: Name: NameFull: Shi, Shikun IsPartOfRelationships: – BibEntity: Dates: – D: 21 M: 06 Text: Jun2025 Type: published Y: 2025 Identifiers: – Type: issn-print Value: 09574522 Numbering: – Type: volume Value: 36 – Type: issue Value: 18 Titles: – TitleFull: Journal of Materials Science: Materials in Electronics Type: main |
| ResultId | 1 |