Exploration of poly(1,4-butanediol diglycidyl ether, 2-methylimidazole, and imidazole) as leveling agents in blind hole copper plating.

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Title: Exploration of poly(1,4-butanediol diglycidyl ether, 2-methylimidazole, and imidazole) as leveling agents in blind hole copper plating.
Authors: Zeng, Xiangjian1, Pan, Zhanchang1, panzhanchang@163.com, Hu, Guanghui1, Xia, Guowei2, Huang, Haiqing2, Zou, Mingliang2, Shi, Shikun2
Source: Journal of Materials Science: Materials in Electronics; Jun2025, Vol. 36 Issue 18, p1-17, 17p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 186232697
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PubType: Academic Journal
PubTypeId: academicJournal
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Items – Name: Title
  Label: Title
  Group: Ti
  Data: Exploration of poly(1,4-butanediol diglycidyl ether, 2-methylimidazole, and imidazole) as leveling agents in blind hole copper plating.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AU" term="%22Zeng%2C+Xiangjian%22">Zeng, Xiangjian</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Pan%2C+Zhanchang%22">Pan, Zhanchang</searchLink><relatesTo>1</relatesTo>, <i>panzhanchang@163.com</i><br /><searchLink fieldCode="AU" term="%22Hu%2C+Guanghui%22">Hu, Guanghui</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Xia%2C+Guowei%22">Xia, Guowei</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Huang%2C+Haiqing%22">Huang, Haiqing</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Zou%2C+Mingliang%22">Zou, Mingliang</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Shi%2C+Shikun%22">Shi, Shikun</searchLink><relatesTo>2</relatesTo>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Jun2025, Vol. 36 Issue 18, p1-17, 17p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=186232697
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1007/s10854-025-15125-y
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 17
        StartPage: 1
    Titles:
      – TitleFull: Exploration of poly(1,4-butanediol diglycidyl ether, 2-methylimidazole, and imidazole) as leveling agents in blind hole copper plating.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Zeng, Xiangjian
      – PersonEntity:
          Name:
            NameFull: Pan, Zhanchang
      – PersonEntity:
          Name:
            NameFull: Hu, Guanghui
      – PersonEntity:
          Name:
            NameFull: Xia, Guowei
      – PersonEntity:
          Name:
            NameFull: Huang, Haiqing
      – PersonEntity:
          Name:
            NameFull: Zou, Mingliang
      – PersonEntity:
          Name:
            NameFull: Shi, Shikun
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 21
              M: 06
              Text: Jun2025
              Type: published
              Y: 2025
          Identifiers:
            – Type: issn-print
              Value: 09574522
          Numbering:
            – Type: volume
              Value: 36
            – Type: issue
              Value: 18
          Titles:
            – TitleFull: Journal of Materials Science: Materials in Electronics
              Type: main
ResultId 1