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Zhaozhou Bridge inspired embedded material extrusion 3D printing of Csf/SiC ceramic matrix composites.

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Title: Zhaozhou Bridge inspired embedded material extrusion 3D printing of Csf/SiC ceramic matrix composites.
Authors: Wang, Wenqing1, Gao, Xiong1, Chen, Xiaotong1, De Marzi, Anna2, Huang, Kai2, He, Rujie1, herujie@bit.edu.cn, Colombo, Paolo2, paolo.colombo@unipd.it
Source: Journal of the American Ceramic Society; Sep2025, Vol. 108 Issue 9, p1-10, 10p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 186371198
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Zhaozhou Bridge inspired embedded material extrusion 3D printing of Csf/SiC ceramic matrix composites.
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  Data: <searchLink fieldCode="AU" term="%22Wang%2C+Wenqing%22">Wang, Wenqing</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Gao%2C+Xiong%22">Gao, Xiong</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Chen%2C+Xiaotong%22">Chen, Xiaotong</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22De+Marzi%2C+Anna%22">De Marzi, Anna</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Huang%2C+Kai%22">Huang, Kai</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22He%2C+Rujie%22">He, Rujie</searchLink><relatesTo>1</relatesTo>, <i>herujie@bit.edu.cn</i><br /><searchLink fieldCode="AU" term="%22Colombo%2C+Paolo%22">Colombo, Paolo</searchLink><relatesTo>2</relatesTo>, <i>paolo.colombo@unipd.it</i>
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      – Type: doi
        Value: 10.1111/jace.20644
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      – Code: eng
        Text: English
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      – TitleFull: Zhaozhou Bridge inspired embedded material extrusion 3D printing of Csf/SiC ceramic matrix composites.
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            NameFull: Wang, Wenqing
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            NameFull: Gao, Xiong
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            NameFull: Huang, Kai
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            NameFull: He, Rujie
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            – D: 01
              M: 09
              Text: Sep2025
              Type: published
              Y: 2025
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