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A Simulation Study on Heat Transfer of a Three-Layer Contact Structure under Ultrahigh Heat Flux Considering Thermal Contact Resistance.

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Title: A Simulation Study on Heat Transfer of a Three-Layer Contact Structure under Ultrahigh Heat Flux Considering Thermal Contact Resistance.
Authors: Ren, Xingjie1,2, renxingjie@sdu.edu.cn, Zhang, Jianrong3,4, Tang, Qingfeng3, Zhang, Heng3, Zhang, Yaling3,4, zhangyl@impcas.ac.cn
Source: Frontiers in Heat & Mass Transfer; 2025, Vol. 23 Issue 3, p881-897, 17p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 186416545
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: A Simulation Study on Heat Transfer of a Three-Layer Contact Structure under Ultrahigh Heat Flux Considering Thermal Contact Resistance.
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  Data: <searchLink fieldCode="AU" term="%22Ren%2C+Xingjie%22">Ren, Xingjie</searchLink><relatesTo>1,2</relatesTo>, <i>renxingjie@sdu.edu.cn</i><br /><searchLink fieldCode="AU" term="%22Zhang%2C+Jianrong%22">Zhang, Jianrong</searchLink><relatesTo>3,4</relatesTo><br /><searchLink fieldCode="AU" term="%22Tang%2C+Qingfeng%22">Tang, Qingfeng</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhang%2C+Heng%22">Zhang, Heng</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhang%2C+Yaling%22">Zhang, Yaling</searchLink><relatesTo>3,4</relatesTo>, <i>zhangyl@impcas.ac.cn</i>
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  Data: <searchLink fieldCode="JN" term="%22Frontiers+in+Heat+%26+Mass+Transfer%22">Frontiers in Heat & Mass Transfer</searchLink>; 2025, Vol. 23 Issue 3, p881-897, 17p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=186416545
RecordInfo BibRecord:
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      – Type: doi
        Value: 10.32604/fhmt.2025.066302
    Languages:
      – Code: eng
        Text: English
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        PageCount: 17
        StartPage: 881
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      – TitleFull: A Simulation Study on Heat Transfer of a Three-Layer Contact Structure under Ultrahigh Heat Flux Considering Thermal Contact Resistance.
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            NameFull: Ren, Xingjie
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            NameFull: Zhang, Jianrong
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            NameFull: Tang, Qingfeng
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            NameFull: Zhang, Heng
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            – D: 01
              M: 05
              Text: 2025
              Type: published
              Y: 2025
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              Value: 23
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