Fiber-based strain sensor based on layer-by-layer assembled TPU/CTS@MXene with wrinkled structure.

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Title: Fiber-based strain sensor based on layer-by-layer assembled TPU/CTS@MXene with wrinkled structure.
Authors: Zhang, Wentong1, Cheng, Hengyi1, Liu, Yanghang1, Shi, Xianhui1, Yu, Dan1, yudan@dhu.edu.cn, Wang, Wei1, wangv@dhu.edu.cn
Source: Journal of Materials Science; Jul2025, Vol. 60 Issue 28, p11829-11844, 16p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 186780610
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PubType: Academic Journal
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  Data: Fiber-based strain sensor based on layer-by-layer assembled TPU/CTS@MXene with wrinkled structure.
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  Data: <searchLink fieldCode="AU" term="%22Zhang%2C+Wentong%22">Zhang, Wentong</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Cheng%2C+Hengyi%22">Cheng, Hengyi</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Liu%2C+Yanghang%22">Liu, Yanghang</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Shi%2C+Xianhui%22">Shi, Xianhui</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Yu%2C+Dan%22">Yu, Dan</searchLink><relatesTo>1</relatesTo>, <i>yudan@dhu.edu.cn</i><br /><searchLink fieldCode="AU" term="%22Wang%2C+Wei%22">Wang, Wei</searchLink><relatesTo>1</relatesTo>, <i>wangv@dhu.edu.cn</i>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%22">Journal of Materials Science</searchLink>; Jul2025, Vol. 60 Issue 28, p11829-11844, 16p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=186780610
RecordInfo BibRecord:
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    Identifiers:
      – Type: doi
        Value: 10.1007/s10853-025-11145-5
    Languages:
      – Code: eng
        Text: English
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        PageCount: 16
        StartPage: 11829
    Titles:
      – TitleFull: Fiber-based strain sensor based on layer-by-layer assembled TPU/CTS@MXene with wrinkled structure.
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            NameFull: Zhang, Wentong
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            NameFull: Cheng, Hengyi
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            NameFull: Liu, Yanghang
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            NameFull: Shi, Xianhui
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            NameFull: Yu, Dan
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            NameFull: Wang, Wei
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            – D: 22
              M: 07
              Text: Jul2025
              Type: published
              Y: 2025
          Identifiers:
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              Value: 00222461
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              Value: 60
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              Value: 28
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            – TitleFull: Journal of Materials Science
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