APA (7th ed.) Citation

Wang, X., Ma, W., Hu, Y., Yang, H., Yang, J., Samart, C., . . . Zhang, H. (2025). Engineered Spherical Silver Powders for Low-Resistance Sintered Conductive Pastes. Journal of Electronic Materials, 54(9), 7789. https://doi.org/10.1007/s11664-025-12156-3

Chicago Style (17th ed.) Citation

Wang, Xinran, et al. "Engineered Spherical Silver Powders for Low-Resistance Sintered Conductive Pastes." Journal of Electronic Materials 54, no. 9 (2025): 7789. https://doi.org/10.1007/s11664-025-12156-3.

MLA (9th ed.) Citation

Wang, Xinran, et al. "Engineered Spherical Silver Powders for Low-Resistance Sintered Conductive Pastes." Journal of Electronic Materials, vol. 54, no. 9, 2025, p. 7789, https://doi.org/10.1007/s11664-025-12156-3.