Engineered Spherical Silver Powders for Low-Resistance Sintered Conductive Pastes.
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| Title: | Engineered Spherical Silver Powders for Low-Resistance Sintered Conductive Pastes. |
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| Authors: | Wang, Xinran1,2, Ma, Weigang1,2, Hu, Yongming3, Yang, Huabin2,4, Yang, Junsheng5, Samart, Chanatip6, Tran, Nguyen-Minh-An7, Kongparakul, Suwadee6, Wang, Junfeng8, Tan, Hua1,2,9, hua_tan@hust.edu.cn, Zhang, Haibo1,2,6,7,10, hbzhang@hust.edu.cn |
| Source: | Journal of Electronic Materials; Sep2025, Vol. 54 Issue 9, p7789-7800, 12p |
| Database: | Applied Science & Technology Source |
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| FullText | Links: – Type: pdflink Text: Availability: 1 |
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| Header | DbId: aci DbLabel: Applied Science & Technology Source An: 187262856 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Engineered Spherical Silver Powders for Low-Resistance Sintered Conductive Pastes. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AU" term="%22Wang%2C+Xinran%22">Wang, Xinran</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Ma%2C+Weigang%22">Ma, Weigang</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Hu%2C+Yongming%22">Hu, Yongming</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Yang%2C+Huabin%22">Yang, Huabin</searchLink><relatesTo>2,4</relatesTo><br /><searchLink fieldCode="AU" term="%22Yang%2C+Junsheng%22">Yang, Junsheng</searchLink><relatesTo>5</relatesTo><br /><searchLink fieldCode="AU" term="%22Samart%2C+Chanatip%22">Samart, Chanatip</searchLink><relatesTo>6</relatesTo><br /><searchLink fieldCode="AU" term="%22Tran%2C+Nguyen-Minh-An%22">Tran, Nguyen-Minh-An</searchLink><relatesTo>7</relatesTo><br /><searchLink fieldCode="AU" term="%22Kongparakul%2C+Suwadee%22">Kongparakul, Suwadee</searchLink><relatesTo>6</relatesTo><br /><searchLink fieldCode="AU" term="%22Wang%2C+Junfeng%22">Wang, Junfeng</searchLink><relatesTo>8</relatesTo><br /><searchLink fieldCode="AU" term="%22Tan%2C+Hua%22">Tan, Hua</searchLink><relatesTo>1,2,9</relatesTo>, <i>hua_tan@hust.edu.cn</i><br /><searchLink fieldCode="AU" term="%22Zhang%2C+Haibo%22">Zhang, Haibo</searchLink><relatesTo>1,2,6,7,10</relatesTo>, <i>hbzhang@hust.edu.cn</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Materials%22">Journal of Electronic Materials</searchLink>; Sep2025, Vol. 54 Issue 9, p7789-7800, 12p |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=187262856 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1007/s11664-025-12156-3 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 12 StartPage: 7789 Titles: – TitleFull: Engineered Spherical Silver Powders for Low-Resistance Sintered Conductive Pastes. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Wang, Xinran – PersonEntity: Name: NameFull: Ma, Weigang – PersonEntity: Name: NameFull: Hu, Yongming – PersonEntity: Name: NameFull: Yang, Huabin – PersonEntity: Name: NameFull: Yang, Junsheng – PersonEntity: Name: NameFull: Samart, Chanatip – PersonEntity: Name: NameFull: Tran, Nguyen-Minh-An – PersonEntity: Name: NameFull: Kongparakul, Suwadee – PersonEntity: Name: NameFull: Wang, Junfeng – PersonEntity: Name: NameFull: Tan, Hua – PersonEntity: Name: NameFull: Zhang, Haibo IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 09 Text: Sep2025 Type: published Y: 2025 Identifiers: – Type: issn-print Value: 03615235 Numbering: – Type: volume Value: 54 – Type: issue Value: 9 Titles: – TitleFull: Journal of Electronic Materials Type: main |
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