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70‐1:Invited Paper: Challenges of Atomic‐Layer‐Deposited Oxide Semiconductor Channels beyond PVD: Material, Devices, and M3D Stacked Structures.

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Title: 70‐1:Invited Paper: Challenges of Atomic‐Layer‐Deposited Oxide Semiconductor Channels beyond PVD: Material, Devices, and M3D Stacked Structures.
Authors: Kim, Yoon-Seo1, Choi, Su-Hwan2, Oh, Hyejin1, Hwang, Taewon1, Park, Jin-Seong1,2
Source: SID Symposium Digest of Technical Papers; Jun2025, Vol. 56 Issue 1, p946-949, 4p
Database: Applied Science & Technology Source
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DbLabel: Applied Science & Technology Source
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PubType: Academic Journal
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  Data: 70‐1:Invited Paper: Challenges of Atomic‐Layer‐Deposited Oxide Semiconductor Channels beyond PVD: Material, Devices, and M3D Stacked Structures.
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  Data: <searchLink fieldCode="AU" term="%22Kim%2C+Yoon-Seo%22">Kim, Yoon-Seo</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Choi%2C+Su-Hwan%22">Choi, Su-Hwan</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Oh%2C+Hyejin%22">Oh, Hyejin</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Hwang%2C+Taewon%22">Hwang, Taewon</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Park%2C+Jin-Seong%22">Park, Jin-Seong</searchLink><relatesTo>1,2</relatesTo>
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  Data: <searchLink fieldCode="JN" term="%22SID+Symposium+Digest+of+Technical+Papers%22">SID Symposium Digest of Technical Papers</searchLink>; Jun2025, Vol. 56 Issue 1, p946-949, 4p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=187391646
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        Value: 10.1002/sdtp.18327
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        Text: English
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      – TitleFull: 70‐1:Invited Paper: Challenges of Atomic‐Layer‐Deposited Oxide Semiconductor Channels beyond PVD: Material, Devices, and M3D Stacked Structures.
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              Text: Jun2025
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              Y: 2025
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