APA (7th ed.) Citation

Noel, P., Larrey, V., Tardif, S., Rieutord, F., Landru, D., & Fournel, F. (2025). Thin dielectric to dielectric hydrophilic wafer bonding for FD-SOI and C-FET manufacturing. Solid-State Electronics, 229, N.PAG. https://doi.org/10.1016/j.sse.2025.109188

Chicago Style (17th ed.) Citation

Noel, P., V. Larrey, S. Tardif, F. Rieutord, D. Landru, and F. Fournel. "Thin Dielectric to Dielectric Hydrophilic Wafer Bonding for FD-SOI and C-FET Manufacturing." Solid-State Electronics 229 (2025): N.PAG. https://doi.org/10.1016/j.sse.2025.109188.

MLA (9th ed.) Citation

Noel, P., et al. "Thin Dielectric to Dielectric Hydrophilic Wafer Bonding for FD-SOI and C-FET Manufacturing." Solid-State Electronics, vol. 229, 2025, p. N.PAG, https://doi.org/10.1016/j.sse.2025.109188.