Thin dielectric to dielectric hydrophilic wafer bonding for FD-SOI and C-FET manufacturing.
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| Title: | Thin dielectric to dielectric hydrophilic wafer bonding for FD-SOI and C-FET manufacturing. |
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| Authors: | Noel, P.1, paul.noel@cea.fr, Larrey, V.1, Tardif, S.2, Rieutord, F.3, Landru, D.3, Fournel, F.1 |
| Source: | Solid-State Electronics; Nov2025, Vol. 229, pN.PAG-N.PAG, 1p |
| Database: | Applied Science & Technology Source |
| FullText | Text: Availability: 0 |
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| Header | DbId: aci DbLabel: Applied Science & Technology Source An: 187841064 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Thin dielectric to dielectric hydrophilic wafer bonding for FD-SOI and C-FET manufacturing. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AU" term="%22Noel%2C+P%2E%22">Noel, P.</searchLink><relatesTo>1</relatesTo>, <i>paul.noel@cea.fr</i><br /><searchLink fieldCode="AU" term="%22Larrey%2C+V%2E%22">Larrey, V.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Tardif%2C+S%2E%22">Tardif, S.</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Rieutord%2C+F%2E%22">Rieutord, F.</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Landru%2C+D%2E%22">Landru, D.</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Fournel%2C+F%2E%22">Fournel, F.</searchLink><relatesTo>1</relatesTo> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Solid-State+Electronics%22">Solid-State Electronics</searchLink>; Nov2025, Vol. 229, pN.PAG-N.PAG, 1p |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=187841064 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1016/j.sse.2025.109188 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 1 StartPage: N.PAG Titles: – TitleFull: Thin dielectric to dielectric hydrophilic wafer bonding for FD-SOI and C-FET manufacturing. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Noel, P. – PersonEntity: Name: NameFull: Larrey, V. – PersonEntity: Name: NameFull: Tardif, S. – PersonEntity: Name: NameFull: Rieutord, F. – PersonEntity: Name: NameFull: Landru, D. – PersonEntity: Name: NameFull: Fournel, F. IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 11 Text: Nov2025 Type: published Y: 2025 Identifiers: – Type: issn-print Value: 00381101 Numbering: – Type: volume Value: 229 Titles: – TitleFull: Solid-State Electronics Type: main |
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