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Thin dielectric to dielectric hydrophilic wafer bonding for FD-SOI and C-FET manufacturing.

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Bibliographic Details
Title: Thin dielectric to dielectric hydrophilic wafer bonding for FD-SOI and C-FET manufacturing.
Authors: Noel, P.1, paul.noel@cea.fr, Larrey, V.1, Tardif, S.2, Rieutord, F.3, Landru, D.3, Fournel, F.1
Source: Solid-State Electronics; Nov2025, Vol. 229, pN.PAG-N.PAG, 1p
Database: Applied Science & Technology Source
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