Anisotropic Microstructural Evolution in Eutectic Sn–Bi Solders Under Isothermal Aging and Cyclic Loading: A Phase-Field Perspective.

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Bibliographic Details
Title: Anisotropic Microstructural Evolution in Eutectic Sn–Bi Solders Under Isothermal Aging and Cyclic Loading: A Phase-Field Perspective.
Authors: Mohammad, Suleiman Ibrahim1,2, ibrahimmohammadsuleiman61@gmail.com, Owida, Hamza Abu3, Kumar, Raman4,5, Beemkumar, N.6, Mahapatro, Abinash7, Jacob, Ashwin8, Pant, Ruby9
Source: Journal of Electronic Materials; Oct2025, Vol. 54 Issue 10, p9286-9301, 16p
Database: Applied Science & Technology Source
Description
ISSN:03615235
DOI:10.1007/s11664-025-12295-7