An Investigation of Three-Dimensional Void Changes and Top-Down Microcrack Formation of AC-16 in Rutted and Non-Rutted Zones Under Extremely High Temperature and Heavy Load.

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Title: An Investigation of Three-Dimensional Void Changes and Top-Down Microcrack Formation of AC-16 in Rutted and Non-Rutted Zones Under Extremely High Temperature and Heavy Load.
Authors: Xu, Zhoucong1,2, Fan, Wenruo2,3, Wang, Hui3,4, mickysophy@cqu.edu.cn
Source: Applied Sciences (2076-3417); Sep2025, Vol. 15 Issue 17, p9464, 19p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 187980339
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PubType: Academic Journal
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  Data: An Investigation of Three-Dimensional Void Changes and Top-Down Microcrack Formation of AC-16 in Rutted and Non-Rutted Zones Under Extremely High Temperature and Heavy Load.
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  Data: <searchLink fieldCode="AU" term="%22Xu%2C+Zhoucong%22">Xu, Zhoucong</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Fan%2C+Wenruo%22">Fan, Wenruo</searchLink><relatesTo>2,3</relatesTo><br /><searchLink fieldCode="AU" term="%22Wang%2C+Hui%22">Wang, Hui</searchLink><relatesTo>3,4</relatesTo>, <i>mickysophy@cqu.edu.cn</i>
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  Data: <searchLink fieldCode="JN" term="%22Applied+Sciences+%282076-3417%29%22">Applied Sciences (2076-3417)</searchLink>; Sep2025, Vol. 15 Issue 17, p9464, 19p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=187980339
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.3390/app15179464
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 19
        StartPage: 9464
    Titles:
      – TitleFull: An Investigation of Three-Dimensional Void Changes and Top-Down Microcrack Formation of AC-16 in Rutted and Non-Rutted Zones Under Extremely High Temperature and Heavy Load.
        Type: main
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      – PersonEntity:
          Name:
            NameFull: Xu, Zhoucong
      – PersonEntity:
          Name:
            NameFull: Fan, Wenruo
      – PersonEntity:
          Name:
            NameFull: Wang, Hui
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          Dates:
            – D: 01
              M: 09
              Text: Sep2025
              Type: published
              Y: 2025
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              Value: 15
            – Type: issue
              Value: 17
          Titles:
            – TitleFull: Applied Sciences (2076-3417)
              Type: main
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