Grain refinement and interfacial IMCs suppression via Zn addition to enhance the mechanical properties of Cu/Sn-58Bi/Cu microbump.
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| Title: | Grain refinement and interfacial IMCs suppression via Zn addition to enhance the mechanical properties of Cu/Sn-58Bi/Cu microbump. |
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| Authors: | Lin, Pin-Ling1, Wu, Zih-You1, Lee, Yin-Ku1, Chen, Zi-Xu1, Lin, Ta-Wei1, Chen, Po-Yu1, Duh, Jenq-Gong1, jgd@mx.nthu.edu.tw |
| Source: | Journal of Materials Science: Materials in Electronics; Sep2025, Vol. 36 Issue 27, p1-9, 9p |
| Database: | Applied Science & Technology Source |
| ISSN: | 09574522 |
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| DOI: | 10.1007/s10854-025-15748-1 |
