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Grain refinement and interfacial IMCs suppression via Zn addition to enhance the mechanical properties of Cu/Sn-58Bi/Cu microbump.

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Title: Grain refinement and interfacial IMCs suppression via Zn addition to enhance the mechanical properties of Cu/Sn-58Bi/Cu microbump.
Authors: Lin, Pin-Ling1, Wu, Zih-You1, Lee, Yin-Ku1, Chen, Zi-Xu1, Lin, Ta-Wei1, Chen, Po-Yu1, Duh, Jenq-Gong1, jgd@mx.nthu.edu.tw
Source: Journal of Materials Science: Materials in Electronics; Sep2025, Vol. 36 Issue 27, p1-9, 9p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 188439317
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Grain refinement and interfacial IMCs suppression via Zn addition to enhance the mechanical properties of Cu/Sn-58Bi/Cu microbump.
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  Data: <searchLink fieldCode="AU" term="%22Lin%2C+Pin-Ling%22">Lin, Pin-Ling</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Wu%2C+Zih-You%22">Wu, Zih-You</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Lee%2C+Yin-Ku%22">Lee, Yin-Ku</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Chen%2C+Zi-Xu%22">Chen, Zi-Xu</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Lin%2C+Ta-Wei%22">Lin, Ta-Wei</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Chen%2C+Po-Yu%22">Chen, Po-Yu</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Duh%2C+Jenq-Gong%22">Duh, Jenq-Gong</searchLink><relatesTo>1</relatesTo>, <i>jgd@mx.nthu.edu.tw</i>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Sep2025, Vol. 36 Issue 27, p1-9, 9p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=188439317
RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1007/s10854-025-15748-1
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      – Code: eng
        Text: English
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        PageCount: 9
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      – TitleFull: Grain refinement and interfacial IMCs suppression via Zn addition to enhance the mechanical properties of Cu/Sn-58Bi/Cu microbump.
        Type: main
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      – PersonEntity:
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            NameFull: Lin, Pin-Ling
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            NameFull: Wu, Zih-You
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            NameFull: Lee, Yin-Ku
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            NameFull: Chen, Zi-Xu
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            NameFull: Lin, Ta-Wei
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            NameFull: Chen, Po-Yu
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            – D: 21
              M: 09
              Text: Sep2025
              Type: published
              Y: 2025
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              Value: 36
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              Value: 27
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            – TitleFull: Journal of Materials Science: Materials in Electronics
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