Awal, M. S., & Rahman, M. T. (2025). Impedance Leakage Vulnerability and Its Utilization in Reverse-Engineering Embedded Software. ACM Journal on Emerging Technologies in Computing Systems, 21(4), 1. https://doi.org/10.1145/3764931
Chicago Style (17th ed.) CitationAwal, Md Sadik, and Md Tauhidur Rahman. "Impedance Leakage Vulnerability and Its Utilization in Reverse-Engineering Embedded Software." ACM Journal on Emerging Technologies in Computing Systems 21, no. 4 (2025): 1. https://doi.org/10.1145/3764931.
MLA (9th ed.) CitationAwal, Md Sadik, and Md Tauhidur Rahman. "Impedance Leakage Vulnerability and Its Utilization in Reverse-Engineering Embedded Software." ACM Journal on Emerging Technologies in Computing Systems, vol. 21, no. 4, 2025, p. 1, https://doi.org/10.1145/3764931.