Impedance Leakage Vulnerability and Its Utilization in Reverse-Engineering Embedded Software.

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Title: Impedance Leakage Vulnerability and Its Utilization in Reverse-Engineering Embedded Software.
Authors: Awal, Md Sadik1, mawal003@fiu.edu, Rahman, Md Tauhidur1, mdtrahma@fiu.edu
Source: ACM Journal on Emerging Technologies in Computing Systems; Oct2025, Vol. 21 Issue 4, p1-20, 20p
Database: Applied Science & Technology Source
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        Value: 10.1145/3764931
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        Text: English
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        PageCount: 20
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      – TitleFull: Impedance Leakage Vulnerability and Its Utilization in Reverse-Engineering Embedded Software.
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            NameFull: Awal, Md Sadik
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            NameFull: Rahman, Md Tauhidur
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            – D: 01
              M: 10
              Text: Oct2025
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              Y: 2025
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