APA (7th ed.) Citation

Wang, X., Lu, D., Luo, Z., Lian, Z., Li, Y., Pan, H., . . . Ji, H. (2025). Ligand‐Engineered Cu@Ni Core‐Shell Nanoparticles with Excellent Performance for Printed Electronics. Advanced Materials Technologies, 10(22), 1. https://doi.org/10.1002/admt.202500585

Chicago Style (17th ed.) Citation

Wang, Xiuqi, et al. "Ligand‐Engineered Cu@Ni Core‐Shell Nanoparticles with Excellent Performance for Printed Electronics." Advanced Materials Technologies 10, no. 22 (2025): 1. https://doi.org/10.1002/admt.202500585.

MLA (9th ed.) Citation

Wang, Xiuqi, et al. "Ligand‐Engineered Cu@Ni Core‐Shell Nanoparticles with Excellent Performance for Printed Electronics." Advanced Materials Technologies, vol. 10, no. 22, 2025, p. 1, https://doi.org/10.1002/admt.202500585.