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Ligand‐Engineered Cu@Ni Core‐Shell Nanoparticles with Excellent Performance for Printed Electronics.

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Title: Ligand‐Engineered Cu@Ni Core‐Shell Nanoparticles with Excellent Performance for Printed Electronics.
Authors: Wang, Xiuqi1, Lu, Dashi1, Luo, Zikang1, Lian, Zheng1, Li, Yifan1, Pan, Hao2, Miao, Xuan1, Xin, Meiling3, Xu, Jie3, Song, Linlin4, Li, Mingyu1, Ji, Hongjun1, jhj7005@hit.edu.cn
Source: Advanced Materials Technologies; 11/19/2025, Vol. 10 Issue 22, p1-16, 16p
Database: Applied Science & Technology Source
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An: 189423479
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PubType: Academic Journal
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  Data: Ligand‐Engineered Cu@Ni Core‐Shell Nanoparticles with Excellent Performance for Printed Electronics.
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  Data: <searchLink fieldCode="AU" term="%22Wang%2C+Xiuqi%22">Wang, Xiuqi</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Lu%2C+Dashi%22">Lu, Dashi</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Luo%2C+Zikang%22">Luo, Zikang</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Lian%2C+Zheng%22">Lian, Zheng</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Li%2C+Yifan%22">Li, Yifan</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Pan%2C+Hao%22">Pan, Hao</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Miao%2C+Xuan%22">Miao, Xuan</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Xin%2C+Meiling%22">Xin, Meiling</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Xu%2C+Jie%22">Xu, Jie</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Song%2C+Linlin%22">Song, Linlin</searchLink><relatesTo>4</relatesTo><br /><searchLink fieldCode="AU" term="%22Li%2C+Mingyu%22">Li, Mingyu</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Ji%2C+Hongjun%22">Ji, Hongjun</searchLink><relatesTo>1</relatesTo>, <i>jhj7005@hit.edu.cn</i>
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  Data: <searchLink fieldCode="JN" term="%22Advanced+Materials+Technologies%22">Advanced Materials Technologies</searchLink>; 11/19/2025, Vol. 10 Issue 22, p1-16, 16p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=189423479
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        Value: 10.1002/admt.202500585
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              Text: 11/19/2025
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