Ligand‐Engineered Cu@Ni Core‐Shell Nanoparticles with Excellent Performance for Printed Electronics. - Wang, Xiuqi; Lu, Dashi; Luo, Zikang; Lian, Zheng; Li, Yifan; Pan, Hao; Miao, Xuan; Xin, Meiling; Xu, Jie; Song, Linlin; Li, Mingyu; Ji, Hongjun (Advanced Materials Technologies, 2025)