Enhanced fatigue reliability of Sn[sbnd]Bi solder joints through integrated cobalt nanoparticle reinforcement and magnetic field-assisted reflow.
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| Title: | Enhanced fatigue reliability of Sn[sbnd]Bi solder joints through integrated cobalt nanoparticle reinforcement and magnetic field-assisted reflow. |
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| Authors: | Mohammad, Suleiman Ibrahim1,2, Vasudevan, Asokan3,4, Sujai, S.5, Pradhan, Premananda6, Thykattusserry, Nivin Joy7, Singh, Ripendeep1,8, ripendeepsingh1@outlook.com, Bisht, Yashwant Singh9 |
| Source: | Microelectronics Reliability; Jan2026, Vol. 176, pN.PAG-N.PAG, 1p |
| Database: | Applied Science & Technology Source |
| ISSN: | 00262714 |
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| DOI: | 10.1016/j.microrel.2025.115959 |
