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Enhanced fatigue reliability of Sn[sbnd]Bi solder joints through integrated cobalt nanoparticle reinforcement and magnetic field-assisted reflow.

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Title: Enhanced fatigue reliability of Sn[sbnd]Bi solder joints through integrated cobalt nanoparticle reinforcement and magnetic field-assisted reflow.
Authors: Mohammad, Suleiman Ibrahim1,2, Vasudevan, Asokan3,4, Sujai, S.5, Pradhan, Premananda6, Thykattusserry, Nivin Joy7, Singh, Ripendeep1,8, ripendeepsingh1@outlook.com, Bisht, Yashwant Singh9
Source: Microelectronics Reliability; Jan2026, Vol. 176, pN.PAG-N.PAG, 1p
Database: Applied Science & Technology Source
FullText Text:
  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 190745769
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=190745769
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1016/j.microrel.2025.115959
    Languages:
      – Code: eng
        Text: English
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        PageCount: 1
        StartPage: N.PAG
    Titles:
      – TitleFull: Enhanced fatigue reliability of Sn[sbnd]Bi solder joints through integrated cobalt nanoparticle reinforcement and magnetic field-assisted reflow.
        Type: main
  BibRelationships:
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      – PersonEntity:
          Name:
            NameFull: Mohammad, Suleiman Ibrahim
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            NameFull: Vasudevan, Asokan
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            NameFull: Sujai, S.
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            NameFull: Pradhan, Premananda
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            NameFull: Thykattusserry, Nivin Joy
      – PersonEntity:
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            NameFull: Singh, Ripendeep
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            NameFull: Bisht, Yashwant Singh
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          Dates:
            – D: 01
              M: 01
              Text: Jan2026
              Type: published
              Y: 2026
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              Value: 00262714
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              Value: 176
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            – TitleFull: Microelectronics Reliability
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