Thermal Analysis and Thermal–Mechanical Stress Simulation of Polycrystalline Diamond Compact Bits During Rock Breaking Process.

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Bibliographic Details
Title: Thermal Analysis and Thermal–Mechanical Stress Simulation of Polycrystalline Diamond Compact Bits During Rock Breaking Process.
Authors: Zhang, Zengzeng1, Gao, Xiaoting1,2, Liu, Jianping1,3, Su, Tian1, yanqing1210@sdut.edu.cn, Yan, Qing1,2, Dou, Fakai1,3, Mei, Xuefeng2, sutian@sdut.edu.cn, Wang, Meiyan3
Source: Coatings (2079-6412); Jan2026, Vol. 16 Issue 1, p30, 21p
Database: Applied Science & Technology Source
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ISSN:20796412
DOI:10.3390/coatings16010030