APA (7th ed.) Citation

Yoshimori, S., Kitazawa, T., Yukawa, Y., Kosugi, M., Makibuchi, H., Tsuchiya, M., . . . Sugibayashi, T. (2026). XPS Investigation into Diffusion-Bonded Homogeneous Cu-Cu and Heterogeneous Cu-Al Junctions. Metals (2075-4701), 16(1), 13. https://doi.org/10.3390/met16010013

Chicago Style (17th ed.) Citation

Yoshimori, Shigeru, Toshiaki Kitazawa, Yasuyuki Yukawa, Miyuki Kosugi, Hiroshi Makibuchi, Mirai Tsuchiya, Shun Yoshida, and Toshio Sugibayashi. "XPS Investigation into Diffusion-Bonded Homogeneous Cu-Cu and Heterogeneous Cu-Al Junctions." Metals (2075-4701) 16, no. 1 (2026): 13. https://doi.org/10.3390/met16010013.

MLA (9th ed.) Citation

Yoshimori, Shigeru, et al. "XPS Investigation into Diffusion-Bonded Homogeneous Cu-Cu and Heterogeneous Cu-Al Junctions." Metals (2075-4701), vol. 16, no. 1, 2026, p. 13, https://doi.org/10.3390/met16010013.