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XPS Investigation into Diffusion-Bonded Homogeneous Cu-Cu and Heterogeneous Cu-Al Junctions.

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Bibliographic Details
Title:	XPS Investigation into Diffusion-Bonded Homogeneous Cu-Cu and Heterogeneous Cu-Al Junctions.
Authors:	Yoshimori, Shigeru^1,2, Kitazawa, Toshiaki², Yukawa, Yasuyuki³, Kosugi, Miyuki^3,4, Makibuchi, Hiroshi^1,2, Tsuchiya, Mirai², Yoshida, Shun^3,4, yosimori@es.takushoku-u.ac.jp, Sugibayashi, Toshio^2,4
Source:	Metals (2075-4701); Jan2026, Vol. 16 Issue 1, p13, 13p
Database:	Applied Science & Technology Source
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Description
ISSN:	20754701
DOI:	10.3390/met16010013