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XPS Investigation into Diffusion-Bonded Homogeneous Cu-Cu and Heterogeneous Cu-Al Junctions.

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Title: XPS Investigation into Diffusion-Bonded Homogeneous Cu-Cu and Heterogeneous Cu-Al Junctions.
Authors: Yoshimori, Shigeru1,2, Kitazawa, Toshiaki2, Yukawa, Yasuyuki3, Kosugi, Miyuki3,4, Makibuchi, Hiroshi1,2, Tsuchiya, Mirai2, Yoshida, Shun3,4, yosimori@es.takushoku-u.ac.jp, Sugibayashi, Toshio2,4
Source: Metals (2075-4701); Jan2026, Vol. 16 Issue 1, p13, 13p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 191219350
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: XPS Investigation into Diffusion-Bonded Homogeneous Cu-Cu and Heterogeneous Cu-Al Junctions.
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  Data: <searchLink fieldCode="AU" term="%22Yoshimori%2C+Shigeru%22">Yoshimori, Shigeru</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Kitazawa%2C+Toshiaki%22">Kitazawa, Toshiaki</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Yukawa%2C+Yasuyuki%22">Yukawa, Yasuyuki</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Kosugi%2C+Miyuki%22">Kosugi, Miyuki</searchLink><relatesTo>3,4</relatesTo><br /><searchLink fieldCode="AU" term="%22Makibuchi%2C+Hiroshi%22">Makibuchi, Hiroshi</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Tsuchiya%2C+Mirai%22">Tsuchiya, Mirai</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Yoshida%2C+Shun%22">Yoshida, Shun</searchLink><relatesTo>3,4</relatesTo>, <i>yosimori@es.takushoku-u.ac.jp</i><br /><searchLink fieldCode="AU" term="%22Sugibayashi%2C+Toshio%22">Sugibayashi, Toshio</searchLink><relatesTo>2,4</relatesTo>
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  Data: <searchLink fieldCode="JN" term="%22Metals+%282075-4701%29%22">Metals (2075-4701)</searchLink>; Jan2026, Vol. 16 Issue 1, p13, 13p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=191219350
RecordInfo BibRecord:
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    Identifiers:
      – Type: doi
        Value: 10.3390/met16010013
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 13
        StartPage: 13
    Titles:
      – TitleFull: XPS Investigation into Diffusion-Bonded Homogeneous Cu-Cu and Heterogeneous Cu-Al Junctions.
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            NameFull: Yoshimori, Shigeru
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            NameFull: Kitazawa, Toshiaki
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            NameFull: Yukawa, Yasuyuki
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            NameFull: Makibuchi, Hiroshi
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            NameFull: Tsuchiya, Mirai
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            – D: 01
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              Text: Jan2026
              Type: published
              Y: 2026
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              Value: 16
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            – TitleFull: Metals (2075-4701)
              Type: main
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