XPS Investigation into Diffusion-Bonded Homogeneous Cu-Cu and Heterogeneous Cu-Al Junctions. - Yoshimori, Shigeru; Kitazawa, Toshiaki; Yukawa, Yasuyuki; Kosugi, Miyuki; Makibuchi, Hiroshi; Tsuchiya, Mirai; Yoshida, Shun; Sugibayashi, Toshio (Metals (2075-4701), 2026)