Microstructural Evolution and Electrical Reliability of TiO2-Reinforced SAC Solder Interconnections under Thermomechanical Fatigue. - Mohammad, Suleiman Ibrahim; Vasudevan, Asokan; Sujai, S.; Pradhan, Premananda; Thykattusserry, Nivin Joy; Singh, Ripendeep; Bisht, Yashwant Singh (Journal of Electronic Materials, 2026)