邹启凡, 洪, 刘., 罗海亮, & 杨荣贵. (2026). 高功率大面积 AI 芯片液冷技术进展. Journal of Refrigeration, 47(1), 20. https://doi.org/10.12465/issn.0253-4339.20251011001
Chicago Style (17th ed.) Citation邹启凡, 刘 洪, 罗海亮, and 杨荣贵. "高功率大面积 AI 芯片液冷技术进展." Journal of Refrigeration 47, no. 1 (2026): 20. https://doi.org/10.12465/issn.0253-4339.20251011001.
MLA (9th ed.) Citation邹启凡, et al. "高功率大面积 AI 芯片液冷技术进展." Journal of Refrigeration, vol. 47, no. 1, 2026, p. 20, https://doi.org/10.12465/issn.0253-4339.20251011001.
Warning: These citations may not always be 100% accurate.
