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高功率大面积 AI 芯片液冷技术进展.

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Bibliographic Details
Title: 高功率大面积 AI 芯片液冷技术进展. (Chinese)
Authors: 邹启凡1,2, 刘 洪3, 罗海亮3, 杨荣贵1,3, ronggui@pku.edu.cn
Source: Journal of Refrigeration; Feb2026, Vol. 47 Issue 1, p20-36, 17p
Database: Applied Science & Technology Source
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  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 191548989
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PubType: Academic Journal
PubTypeId: academicJournal
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  Data: 高功率大面积 AI 芯片液冷技术进展. (Chinese)
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  Data: <searchLink fieldCode="AU" term="%22邹启凡%22">邹启凡</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22刘+洪%22">刘 洪</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22罗海亮%22">罗海亮</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22杨荣贵%22">杨荣贵</searchLink><relatesTo>1,3</relatesTo>, <i>ronggui@pku.edu.cn</i>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Refrigeration%22">Journal of Refrigeration</searchLink>; Feb2026, Vol. 47 Issue 1, p20-36, 17p
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RecordInfo BibRecord:
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    Identifiers:
      – Type: doi
        Value: 10.12465/issn.0253-4339.20251011001
    Languages:
      – Code: chi
        Text: Chinese
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      Pagination:
        PageCount: 17
        StartPage: 20
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      – TitleFull: 高功率大面积 AI 芯片液冷技术进展.
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            NameFull: 邹启凡
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            NameFull: 刘 洪
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            NameFull: 罗海亮
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            NameFull: 杨荣贵
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            – D: 01
              M: 02
              Text: Feb2026
              Type: published
              Y: 2026
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              Value: 47
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              Value: 1
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            – TitleFull: Journal of Refrigeration
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