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高功率大面积 AI 芯片液冷技术进展.

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Bibliographic Details
Title: 高功率大面积 AI 芯片液冷技术进展. (Chinese)
Authors: 邹启凡1,2, 刘 洪3, 罗海亮3, 杨荣贵1,3, ronggui@pku.edu.cn
Source: Journal of Refrigeration; Feb2026, Vol. 47 Issue 1, p20-36, 17p
Database: Applied Science & Technology Source
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