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A novel quality inspection method based on free-form surface digital twin model.

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Title: A novel quality inspection method based on free-form surface digital twin model.
Authors: Qi, Tian-Feng1, Fang, Hai-Rong1, hrfang@bjtu.edu.cn, Liu, Yu-Lin1, Chen, Yu-Fei1, Wang, Hao-Qian1, He, Yu-Fan1
Source: Journal of Intelligent Manufacturing; Mar2026, Vol. 37 Issue 3, p1197-1212, 16p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 191838963
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: A novel quality inspection method based on free-form surface digital twin model.
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  Data: <searchLink fieldCode="AU" term="%22Qi%2C+Tian-Feng%22">Qi, Tian-Feng</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Fang%2C+Hai-Rong%22">Fang, Hai-Rong</searchLink><relatesTo>1</relatesTo>, <i>hrfang@bjtu.edu.cn</i><br /><searchLink fieldCode="AU" term="%22Liu%2C+Yu-Lin%22">Liu, Yu-Lin</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Chen%2C+Yu-Fei%22">Chen, Yu-Fei</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Wang%2C+Hao-Qian%22">Wang, Hao-Qian</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22He%2C+Yu-Fan%22">He, Yu-Fan</searchLink><relatesTo>1</relatesTo>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Intelligent+Manufacturing%22">Journal of Intelligent Manufacturing</searchLink>; Mar2026, Vol. 37 Issue 3, p1197-1212, 16p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=191838963
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      – Type: doi
        Value: 10.1007/s10845-025-02593-6
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      – Code: eng
        Text: English
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        PageCount: 16
        StartPage: 1197
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      – TitleFull: A novel quality inspection method based on free-form surface digital twin model.
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            NameFull: Fang, Hai-Rong
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            NameFull: Liu, Yu-Lin
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            – D: 01
              M: 03
              Text: Mar2026
              Type: published
              Y: 2026
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