APA (7th ed.) Citation

Wang, B., Zhu, P., Zhang, G., Deng, C., He, K., Huang, W., & Pan, K. (2026). Study on the IMC Growth Mechanism of Cu/Sn-58Bi/Cu Joint Under Electromigration with Alternating Current. Crystals (2073-4352), 16(2), 127. https://doi.org/10.3390/cryst16020127

Chicago Style (17th ed.) Citation

Wang, Bo, Peiying Zhu, Guopei Zhang, Chunyuan Deng, Kaixuan He, Wei Huang, and Kailin Pan. "Study on the IMC Growth Mechanism of Cu/Sn-58Bi/Cu Joint Under Electromigration with Alternating Current." Crystals (2073-4352) 16, no. 2 (2026): 127. https://doi.org/10.3390/cryst16020127.

MLA (9th ed.) Citation

Wang, Bo, et al. "Study on the IMC Growth Mechanism of Cu/Sn-58Bi/Cu Joint Under Electromigration with Alternating Current." Crystals (2073-4352), vol. 16, no. 2, 2026, p. 127, https://doi.org/10.3390/cryst16020127.