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Study on the IMC Growth Mechanism of Cu/Sn-58Bi/Cu Joint Under Electromigration with Alternating Current.

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Bibliographic Details
Title: Study on the IMC Growth Mechanism of Cu/Sn-58Bi/Cu Joint Under Electromigration with Alternating Current.
Authors: Wang, Bo1,2, Zhu, Peiying2, Zhang, Guopei3, Deng, Chunyuan1,2, He, Kaixuan1,2, Huang, Wei2,3, Pan, Kailin2, pankl@guet.edu.cn
Source: Crystals (2073-4352); Feb2026, Vol. 16 Issue 2, p127, 14p
Database: Applied Science & Technology Source
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ISSN:20734352
DOI:10.3390/cryst16020127