Study on the IMC Growth Mechanism of Cu/Sn-58Bi/Cu Joint Under Electromigration with Alternating Current.

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Title: Study on the IMC Growth Mechanism of Cu/Sn-58Bi/Cu Joint Under Electromigration with Alternating Current.
Authors: Wang, Bo1,2, Zhu, Peiying2, Zhang, Guopei3, Deng, Chunyuan1,2, He, Kaixuan1,2, Huang, Wei2,3, Pan, Kailin2, pankl@guet.edu.cn
Source: Crystals (2073-4352); Feb2026, Vol. 16 Issue 2, p127, 14p
Database: Applied Science & Technology Source
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An: 192034870
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  Data: Study on the IMC Growth Mechanism of Cu/Sn-58Bi/Cu Joint Under Electromigration with Alternating Current.
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  Data: <searchLink fieldCode="AU" term="%22Wang%2C+Bo%22">Wang, Bo</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhu%2C+Peiying%22">Zhu, Peiying</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhang%2C+Guopei%22">Zhang, Guopei</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Deng%2C+Chunyuan%22">Deng, Chunyuan</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22He%2C+Kaixuan%22">He, Kaixuan</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Huang%2C+Wei%22">Huang, Wei</searchLink><relatesTo>2,3</relatesTo><br /><searchLink fieldCode="AU" term="%22Pan%2C+Kailin%22">Pan, Kailin</searchLink><relatesTo>2</relatesTo>, <i>pankl@guet.edu.cn</i>
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  Data: <searchLink fieldCode="JN" term="%22Crystals+%282073-4352%29%22">Crystals (2073-4352)</searchLink>; Feb2026, Vol. 16 Issue 2, p127, 14p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=192034870
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      – Type: doi
        Value: 10.3390/cryst16020127
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      – Code: eng
        Text: English
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        StartPage: 127
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      – TitleFull: Study on the IMC Growth Mechanism of Cu/Sn-58Bi/Cu Joint Under Electromigration with Alternating Current.
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            NameFull: Wang, Bo
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            NameFull: Zhu, Peiying
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            NameFull: Zhang, Guopei
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            NameFull: He, Kaixuan
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            – D: 01
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              Text: Feb2026
              Type: published
              Y: 2026
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