Li, Y., Li, H., Chen, W., Yang, W., Gu, Z., & Liu, B. (2026). Heat Transfer on an Internal Thermal Insulation Structure for a High-Temperature Device: Numerical Simulation and Experiment. Applied Sciences (2076-3417), 16(4), 2132. https://doi.org/10.3390/app16042132
Chicago Style (17th ed.) CitationLi, Yin, Haihua Li, Wanhua Chen, Wenguo Yang, Zhixu Gu, and Bowen Liu. "Heat Transfer on an Internal Thermal Insulation Structure for a High-Temperature Device: Numerical Simulation and Experiment." Applied Sciences (2076-3417) 16, no. 4 (2026): 2132. https://doi.org/10.3390/app16042132.
MLA (9th ed.) CitationLi, Yin, et al. "Heat Transfer on an Internal Thermal Insulation Structure for a High-Temperature Device: Numerical Simulation and Experiment." Applied Sciences (2076-3417), vol. 16, no. 4, 2026, p. 2132, https://doi.org/10.3390/app16042132.