Heat Transfer on an Internal Thermal Insulation Structure for a High-Temperature Device: Numerical Simulation and Experiment.

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Title: Heat Transfer on an Internal Thermal Insulation Structure for a High-Temperature Device: Numerical Simulation and Experiment.
Authors: Li, Yin1, Li, Haihua1,2, Chen, Wanhua1, Yang, Wenguo1,2, Gu, Zhixu1, Liu, Bowen1, 15b918025@hit.edu.cn
Source: Applied Sciences (2076-3417); Feb2026, Vol. 16 Issue 4, p2132, 18p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 192035734
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  Data: Heat Transfer on an Internal Thermal Insulation Structure for a High-Temperature Device: Numerical Simulation and Experiment.
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  Data: <searchLink fieldCode="AU" term="%22Li%2C+Yin%22">Li, Yin</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Li%2C+Haihua%22">Li, Haihua</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Chen%2C+Wanhua%22">Chen, Wanhua</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Yang%2C+Wenguo%22">Yang, Wenguo</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Gu%2C+Zhixu%22">Gu, Zhixu</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Liu%2C+Bowen%22">Liu, Bowen</searchLink><relatesTo>1</relatesTo>, <i>15b918025@hit.edu.cn</i>
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PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=192035734
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        Value: 10.3390/app16042132
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      – Code: eng
        Text: English
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      – TitleFull: Heat Transfer on an Internal Thermal Insulation Structure for a High-Temperature Device: Numerical Simulation and Experiment.
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            NameFull: Chen, Wanhua
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              Text: Feb2026
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              Y: 2026
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