Liu, Q., Qiu, R., Su, F., & Shi, H. (2026). Microstructure and properties of resistance spot welded Al/Cu joint with an interlayer of zinc. Journal of Materials Science: Materials in Electronics, 37(8), 1. https://doi.org/10.1007/s10854-026-16985-8
Chicago Style (17th ed.) CitationLiu, Qiansen, Ranfeng Qiu, Fuhao Su, and Hongxin Shi. "Microstructure and Properties of Resistance Spot Welded Al/Cu Joint with an Interlayer of Zinc." Journal of Materials Science: Materials in Electronics 37, no. 8 (2026): 1. https://doi.org/10.1007/s10854-026-16985-8.
MLA (9th ed.) CitationLiu, Qiansen, et al. "Microstructure and Properties of Resistance Spot Welded Al/Cu Joint with an Interlayer of Zinc." Journal of Materials Science: Materials in Electronics, vol. 37, no. 8, 2026, p. 1, https://doi.org/10.1007/s10854-026-16985-8.