AI-enabled high-throughput characterization of material properties based on indentation response.

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Title: AI-enabled high-throughput characterization of material properties based on indentation response.
Authors: Chen, Lizichen1, chenwq@zju.edu.cn, Zhu, Gengxuan1, Chen, Yuanhao1, Lim, C. W.1,2, Chen, Weiqiu1,2,3,4
Source: MechanoEngineering (Diamond); Mar2026, Vol. 1 Issue 1, p1-15, 15p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 192430225
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: AI-enabled high-throughput characterization of material properties based on indentation response.
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  Data: <searchLink fieldCode="AU" term="%22Chen%2C+Lizichen%22">Chen, Lizichen</searchLink><relatesTo>1</relatesTo>, <i>chenwq@zju.edu.cn</i><br /><searchLink fieldCode="AU" term="%22Zhu%2C+Gengxuan%22">Zhu, Gengxuan</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Chen%2C+Yuanhao%22">Chen, Yuanhao</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Lim%2C+C%2E+W%2E%22">Lim, C. W.</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Chen%2C+Weiqiu%22">Chen, Weiqiu</searchLink><relatesTo>1,2,3,4</relatesTo>
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  Data: <searchLink fieldCode="JN" term="%22MechanoEngineering+%28Diamond%29%22">MechanoEngineering (Diamond)</searchLink>; Mar2026, Vol. 1 Issue 1, p1-15, 15p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=192430225
RecordInfo BibRecord:
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    Identifiers:
      – Type: doi
        Value: 10.1063/5.0284635
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      – Code: eng
        Text: English
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        PageCount: 15
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      – TitleFull: AI-enabled high-throughput characterization of material properties based on indentation response.
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            NameFull: Chen, Lizichen
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            NameFull: Zhu, Gengxuan
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            NameFull: Chen, Yuanhao
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            NameFull: Lim, C. W.
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              M: 03
              Text: Mar2026
              Type: published
              Y: 2026
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