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Simulation study on single abrasive removal of Cu/diamond composites.

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Bibliographic Details
Title:	Simulation study on single abrasive removal of Cu/diamond composites. (English)
Authors:	WANG, Henan¹, LIU, Chengwei¹, SUN, Guodong², YU, Xiaolin¹, HUANG, Shutao¹
Source:	Manufacturing Technology & Machine Tool; 2026, Issue 4, p178-185, 8p
Database:	Applied Science & Technology Source

Description
ISSN:	10052402
DOI:	10.19287/j.mtmt.1005-2402.2026.04.019