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Thermal, Microstructural, and Morphological Analysis of Co-Ni-Ce Microalloyed SAC305 Lead-Free Solder Solidified at Low Cooling Rate.

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Title: Thermal, Microstructural, and Morphological Analysis of Co-Ni-Ce Microalloyed SAC305 Lead-Free Solder Solidified at Low Cooling Rate.
Authors: Bődi, Béla1, Gonda, Viktor2, gonda.viktor@bgk.uni-obuda.hu
Source: Metals (2075-4701); Apr2026, Vol. 16 Issue 4, p374, 21p
Database: Applied Science & Technology Source
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PubType: Academic Journal
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  Data: Thermal, Microstructural, and Morphological Analysis of Co-Ni-Ce Microalloyed SAC305 Lead-Free Solder Solidified at Low Cooling Rate.
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        Value: 10.3390/met16040374
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      – Code: eng
        Text: English
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        PageCount: 21
        StartPage: 374
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      – TitleFull: Thermal, Microstructural, and Morphological Analysis of Co-Ni-Ce Microalloyed SAC305 Lead-Free Solder Solidified at Low Cooling Rate.
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              Text: Apr2026
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              Y: 2026
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