Bibliographic Details
| Title: |
Electromigration Reliability and Failure Mechanisms in Novel 3D Cu Stagger-via Interconnects for Advanced High-Density Fan-Out Packaging. |
| Authors: |
Shao, Kuan-Ju1, Chiu, Meng-Chun2, Hu, Jui-Yi2, Liang, Chien-Lung2, clliang@mail.ntust.edu.tw, Tsai, Min-Yan3, Lin, Yung-Sheng3, Wang, Chen-Chao3, Hung, Chih-Pin3, Lin, Kwang-Lung1, matkllin@mail.ncku.edu.tw |
| Source: |
JOM: The Journal of The Minerals, Metals & Materials Society (TMS); Jun2026, Vol. 78 Issue 6, p5188-5206, 19p |
| Database: |
Applied Science & Technology Source |
